Dissimilar material AuSn solder joint for semiconductor packaging
Strongly bonding dissimilar materials such as glass, metal, ceramics, and silicon.
In the semiconductor packaging industry, the bonding technology of dissimilar materials has become important due to the miniaturization and high performance of products. In particular, reliable sealing is essential for the long-term performance maintenance of products. Conventional resin-based adhesives have faced challenges in chemical resistance and long-term reliability, but our AuSn solder sealing technology demonstrates excellent chemical resistance and stable sealing performance even in high vacuum environments, making it suitable for harsh usage conditions. The AuSn solder method using heat treatment allows for seamless sealing through uniform melting, achieving stable sealing joints. 【Application Scenarios】 - Sealing of semiconductor packages - Use in high vacuum environments - Environments requiring chemical resistance 【Benefits of Implementation】 - Ensuring high reliability - Extension of product lifespan - Contribution to miniaturization and high performance
- Company:Citizen Finedevice Co.,Ltd
- Price:Other